Innovative Integration Solutions for SiP Packages Using Fan-Out Wafer Level eWLB Technology

Jacinta Aman Lim; Vinayak Pandey

doi:10.4071/isom-2017-WA42_039

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Lim, Jacinta Aman, and Vinayak Pandey. 2017. “Innovative Integration Solutions for SiP Packages Using Fan-Out Wafer Level eWLB Technology.” IMAPSource Proceedings 2017 (1): 263–69. https://doi.org/10.4071/isom-2017-WA42_039.

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