Vol. 2017, Issue 1, 2017October 01, 2017 EDT
Innovative Integration Solutions for SiP Packages Using Fan-Out Wafer Level eWLB Technology
Innovative Integration Solutions for SiP Packages Using Fan-Out Wafer Level eWLB Technology
Lim, Jacinta Aman, and Vinayak Pandey. 2017. “Innovative Integration Solutions for SiP Packages Using Fan-Out Wafer Level eWLB Technology.” IMAPSource Proceedings 2017 (1): 263–69. https://doi.org/10.4071/isom-2017-WA42_039.