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Symposium Proceedings
Vol. 2017, Issue 1, 2017October 01, 2017 EDT

Innovative Integration Solutions for SiP Packages Using Fan-Out Wafer Level eWLB Technology

Jacinta Aman Lim, Vinayak Pandey,
SiPFan-Out Wafer LevelFOWLPeWLBFan-out
https://doi.org/10.4071/isom-2017-WA42_039
IMAPSource Conference Papers
Lim, Jacinta Aman, and Vinayak Pandey. 2017. “Innovative Integration Solutions for SiP Packages Using Fan-Out Wafer Level eWLB Technology.” IMAPSource Proceedings 2017 (1): 263–69. https:/​/​doi.org/​10.4071/​isom-2017-WA42_039.
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