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Symposium Proceedings
Vol. 2017, Issue 1, 2017October 01, 2017 EDT

Development of Liquid Compression Molding (LCM) Material for Low Warpage

Tsuyoshi Kamimura, Satomi Kawamoto, Daisuke Hashimoto, Yuto Shigeno, Haruyuki Yoshii, Hirokazu Noma, Tomohiro Ookubo, Hisato Takahashi, Hidetoshi Inoue,
Liquid Compression Molding LCM Low Warpage epoxy resin modulus
• https://doi.org/10.4071/isom-2017-TP14_157
IMAPSource Conference Papers
Kamimura, Tsuyoshi, Satomi Kawamoto, Daisuke Hashimoto, Yuto Shigeno, Haruyuki Yoshii, Hirokazu Noma, Tomohiro Ookubo, Hisato Takahashi, and Hidetoshi Inoue. 2017. “Development of Liquid Compression Molding (LCM) Material for Low Warpage.” IMAPSource Proceedings 2017 (1): 25–28. https://doi.org/10.4071/isom-2017-TP14_157.
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