Using a Metal Oxide Adhesion Layer and Wet Chemical Cu Metallization for Fine Line Pattern Formation on Glass

Merschky, Michael, Fabian Michalik, Martin Thoms, Robin Taylor, Diego Reinoso-Cocina, Stephan Hotz, and Patrick Brooks. 2017. “Using a Metal Oxide Adhesion Layer and Wet Chemical Cu Metallization for Fine Line Pattern Formation on Glass.” IMAPSource Proceedings 2017 (1): 458–63. https:/​/​doi.org/​10.4071/​isom-2017-WP51_084.