Vol. 2017, Issue 1, 2017October 01, 2017 EDT
Ultra-fine Line Multi-Redistribution Layers with 10 μm Pitch Micro-Vias for Wafer Level and Panel Level Packaging realized by an innovative Excimer Laser Dual Damascene Process
Ultra-fine Line Multi-Redistribution Layers with 10 μm Pitch Micro-Vias for Wafer Level and Panel Level Packaging realized by an innovative Excimer Laser Dual Damascene Process
Gernhardt, Robert, Friedrich Müller, Markus Woehrmann, Habib Hichri, Karin Hauck, Michael Toepper, Markus Arendt, and Klaus-Dieter Lang. 2017. “Ultra-Fine Line Multi-Redistribution Layers with 10 Μm Pitch Micro-Vias for Wafer Level and Panel Level Packaging Realized by an Innovative Excimer Laser Dual Damascene Process.” IMAPSource Proceedings 2017 (1): 120–25. https://doi.org/10.4071/isom-2017-TP45_130.
Powered by Scholastica, the modern academic journal management system