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Symposium Proceedings
Vol. 2017, Issue 1, 2017October 01, 2017 EDT

Ultra-fine Line Multi-Redistribution Layers with 10 μm Pitch Micro-Vias for Wafer Level and Panel Level Packaging realized by an innovative Excimer Laser Dual Damascene Process

Robert Gernhardt, Friedrich Müller, Markus Woehrmann, Habib Hichri, Karin Hauck, Michael Toepper, Markus Arendt, Klaus-Dieter Lang,
ABFablationdual damasceneexcimer laserfine linemulti-layerpolyimide
https://doi.org/10.4071/isom-2017-TP45_130
IMAPSource Conference Papers
Gernhardt, Robert, Friedrich Müller, Markus Woehrmann, Habib Hichri, Karin Hauck, Michael Toepper, Markus Arendt, and Klaus-Dieter Lang. 2017. “Ultra-Fine Line Multi-Redistribution Layers with 10 Μm Pitch Micro-Vias for Wafer Level and Panel Level Packaging Realized by an Innovative Excimer Laser Dual Damascene Process.” IMAPSource Proceedings 2017 (1): 120–25. https:/​/​doi.org/​10.4071/​isom-2017-TP45_130.
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