Vol. 2017, Issue 1, 2017October 01, 2017 EDT
The IC in the Flexible Hybrid Electronics Technology: Flexibility and Bend Testing
The IC in the Flexible Hybrid Electronics Technology: Flexibility and Bend Testing
Marinov, Val R. 2017. “The IC in the Flexible Hybrid Electronics Technology: Flexibility and Bend Testing.” IMAPSource Proceedings 2017 (1): 103–8. https://doi.org/10.4071/isom-2017-TP42_064.