Vol. 2017, Issue 1, 2017October 01, 2017 EDT
Co-Simulation Based Multi-Chip Module Design Flow and Wi-Fi Module Example with Integrated BAW and LNA
Co-Simulation Based Multi-Chip Module Design Flow and Wi-Fi Module Example with Integrated BAW and LNA
Dekosky, Jeff, Deepukumar Nair, Larry Carastro, and Scott Knapp. 2017. “Co-Simulation Based Multi-Chip Module Design Flow and Wi-Fi Module Example with Integrated BAW and LNA.” IMAPSource Proceedings 2017 (1): 172–75. https://doi.org/10.4071/isom-2017-WA13_035.