Vol. 2017, Issue 1, 2017October 01, 2017 EDT
Direct Measurement of Silicon Strain in a Fine Pitch Flip Chip BGA Package
Direct Measurement of Silicon Strain in a Fine Pitch Flip Chip BGA Package
Whitchurch, Nathan, Glenn Rinne, Wei Lin, and Devarajan Balaraman. 2017. “Direct Measurement of Silicon Strain in a Fine Pitch Flip Chip BGA Package.” IMAPSource Proceedings 2017 (1): 176–81. https://doi.org/10.4071/isom-2017-WA14_097.