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Symposium Proceedings
Vol. 2017, Issue 1, 2017October 01, 2017 EDT

Demonstration of Embedded Cu Trench RDL using Panel Scale Lithography and Photosensitive Dry Film Polymer Dielectrics

Venky Sundaram, Fuhan Liu, Chandra Nair, Rao Tummala, Atsushi Kubo, Tomoyuki Ando, Keith Best, Corey Shay,
EmbeddedCu TrenchRDLPanel Scale LithographyPhotosensitive Dry Film Polymer Dielectricsultra-high resolution2.5D
https://doi.org/10.4071/isom-2017-THP13_159
IMAPSource Conference Papers
Sundaram, Venky, Fuhan Liu, Chandra Nair, Rao Tummala, Atsushi Kubo, Tomoyuki Ando, Keith Best, and Corey Shay. 2017. “Demonstration of Embedded Cu Trench RDL Using Panel Scale Lithography and Photosensitive Dry Film Polymer Dielectrics.” IMAPSource Proceedings 2017 (1): 689–93. https:/​/​doi.org/​10.4071/​isom-2017-THP13_159.
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