Vol. 2017, Issue 1, 2017October 01, 2017 EDT
Demonstration of Embedded Cu Trench RDL using Panel Scale Lithography and Photosensitive Dry Film Polymer Dielectrics
Demonstration of Embedded Cu Trench RDL using Panel Scale Lithography and Photosensitive Dry Film Polymer Dielectrics
Venky Sundaram, Fuhan Liu, Chandra Nair, Rao Tummala, Atsushi Kubo, Tomoyuki Ando, Keith Best, Corey Shay,
Sundaram, Venky, Fuhan Liu, Chandra Nair, Rao Tummala, Atsushi Kubo, Tomoyuki Ando, Keith Best, and Corey Shay. 2017. “Demonstration of Embedded Cu Trench RDL Using Panel Scale Lithography and Photosensitive Dry Film Polymer Dielectrics.” IMAPSource Proceedings 2017 (1): 689–93. https://doi.org/10.4071/isom-2017-THP13_159.
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