Temperature and Process Dependent Material Characterization and Multiscale Stress Evolution Analysis for Performance and Reliability Management under Chip Package Interaction

Aditya P. Karmarkar; Xiaopeng Xu; Karim El-Sayed

doi:10.4071/isom-2017-TP13_051

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Karmarkar, Aditya P., Xiaopeng Xu, and Karim El-Sayed. 2017. “Temperature and Process Dependent Material Characterization and Multiscale Stress Evolution Analysis for Performance and Reliability Management under Chip Package Interaction.” IMAPSource Proceedings 2017 (1): 13–24. https://doi.org/10.4071/isom-2017-TP13_051.

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