ISSN 2380-4505
Vol. 2017, Issue 1, 2017October 01, 2017 EDT
Temperature and Process Dependent Material Characterization and Multiscale Stress Evolution Analysis for Performance and Reliability Management under Chip Package Interaction
Temperature and Process Dependent Material Characterization and Multiscale Stress Evolution Analysis for Performance and Reliability Management under Chip Package Interaction
Karmarkar, Aditya P., Xiaopeng Xu, and Karim El-Sayed. 2017. “Temperature and Process Dependent Material Characterization and Multiscale Stress Evolution Analysis for Performance and Reliability Management under Chip Package Interaction.” IMAPSource Proceedings 2017 (1): 13–24. https://doi.org/10.4071/isom-2017-TP13_051.