Electrical Chip-Board Interaction (e-CBI) of Wafer Level Packaging Technology

Wei Zhao; Mark Nakamoto; Karthikeyan Dhandapani; Brian Henderson; Ron Lindley; Riko Radojcic; Urmi Ray; Aurel Gunterus; Mark Schwarz; Ahmer Syed; Vidhya Ramachandran

doi:10.4071/isom-2017-WP11_048

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Zhao, Wei, Mark Nakamoto, Karthikeyan Dhandapani, Brian Henderson, Ron Lindley, Riko Radojcic, Urmi Ray, et al. 2017. “Electrical Chip-Board Interaction (e-CBI) of Wafer Level Packaging Technology.” IMAPSource Proceedings 2017 (1): 325–30. https://doi.org/10.4071/isom-2017-WP11_048.

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