Electrical Chip-Board Interaction (e-CBI) of Wafer Level Packaging Technology

Zhao, Wei, Mark Nakamoto, Karthikeyan Dhandapani, Brian Henderson, Ron Lindley, Riko Radojcic, Urmi Ray, et al. 2017. “Electrical Chip-Board Interaction (e-CBI) of Wafer Level Packaging Technology.” IMAPSource Proceedings 2017 (1): 325–30. https:/​/​doi.org/​10.4071/​isom-2017-WP11_048.