Vol. 2017, Issue 1, 2017October 01, 2017 EDT
Electrical Chip-Board Interaction (e-CBI) of Wafer Level Packaging Technology
Electrical Chip-Board Interaction (e-CBI) of Wafer Level Packaging Technology
Zhao, Wei, Mark Nakamoto, Karthikeyan Dhandapani, Brian Henderson, Ron Lindley, Riko Radojcic, Urmi Ray, et al. 2017. “Electrical Chip-Board Interaction (e-CBI) of Wafer Level Packaging Technology.” IMAPSource Proceedings 2017 (1): 325–30. https://doi.org/10.4071/isom-2017-WP11_048.