Skip to main content
null
IMAPSource Conference Papers
  • Menu
  • Articles
    • Ceramics Conference Papers
    • Device Packaging Conference Presentations
    • EMPC Conference Proceedings (IMAPS Europe)
    • General
    • High Temperature Conference Papers
    • IMAPS Chapter Conferences
    • Symposium Proceedings
    • All
  • For Authors
  • Editorial Board
  • About
  • Issues
  • Journal Micro & Elect Pkg
  • search

RSS Feed

Enter the URL below into your favorite RSS reader.

http://localhost:20372/feed
Symposium Proceedings
Vol. 2017, Issue 1, 2017October 01, 2017 EDT

Rapid Prototyping Tape Stencils for the Application of Solder Paste

Mimi X. Yang, Karen Dowling, Debbie Senesky, H.-S. Philip Wong,
flip chip bondinglaser cuttingrapid prototypingsolder pastestencil
https://doi.org/10.4071/isom-2017-Poster2_040
IMAPSource Conference Papers
Yang, Mimi X., Karen Dowling, Debbie Senesky, and H.-S. Philip Wong. 2017. “Rapid Prototyping Tape Stencils for the Application of Solder Paste.” IMAPSource Proceedings 2017 (1): 652–58. https:/​/​doi.org/​10.4071/​isom-2017-Poster2_040.
Save article as...▾

View more stats

This website uses cookies

We use cookies to enhance your experience and support COUNTER Metrics for transparent reporting of readership statistics. Cookie data is not sold to third parties or used for marketing purposes.

Powered by Scholastica, the modern academic journal management system