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Symposium Proceedings
Vol. 2017, Issue 1, 2017October 01, 2017 EDT

A Generic Strategy to Assess and Mitigate Chip Package Interaction Risk Factors for Semiconductor Devices with Ultra-low k Dielectric Materials in Back End of Line

Frank Kuechenmeister, Dirk Breuer, Holm Geisler, Christian Klewer, Bjoern Boehme, Kashi Vishwanath Machani, Michael Hecker, Christian Goetze, Jae Kyu Cho, Himani Kamineni, Jens Paul, Michael Thiele,
Back End of Line (BEoL)Chip-Package Interaction (CPI)Dual Cantilever Beam (DCB)Flip-Chip CSPModified Edge Lift-off Test (MELT)Wafer Level Packaging22FDX® Technology14nm TechnologyReliability
https://doi.org/10.4071/isom-2017-WA12_066
IMAPSource Conference Papers
Kuechenmeister, Frank, Dirk Breuer, Holm Geisler, Christian Klewer, Bjoern Boehme, Kashi Vishwanath Machani, Michael Hecker, et al. 2017. “A Generic Strategy to Assess and Mitigate Chip Package Interaction Risk Factors for Semiconductor Devices with Ultra-Low k Dielectric Materials in Back End of Line.” IMAPSource Proceedings 2017 (1): 163–71. https:/​/​doi.org/​10.4071/​isom-2017-WA12_066.
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