Vol. 2017, Issue 1, 2017October 01, 2017 EDT
A Generic Strategy to Assess and Mitigate Chip Package Interaction Risk Factors for Semiconductor Devices with Ultra-low k Dielectric Materials in Back End of Line
A Generic Strategy to Assess and Mitigate Chip Package Interaction Risk Factors for Semiconductor Devices with Ultra-low k Dielectric Materials in Back End of Line
Frank Kuechenmeister, Dirk Breuer, Holm Geisler, Christian Klewer, Bjoern Boehme, Kashi Vishwanath Machani, Michael Hecker, Christian Goetze, Jae Kyu Cho, Himani Kamineni, Jens Paul, Michael Thiele,
Kuechenmeister, Frank, Dirk Breuer, Holm Geisler, Christian Klewer, Bjoern Boehme, Kashi Vishwanath Machani, Michael Hecker, et al. 2017. “A Generic Strategy to Assess and Mitigate Chip Package Interaction Risk Factors for Semiconductor Devices with Ultra-Low k Dielectric Materials in Back End of Line.” IMAPSource Proceedings 2017 (1): 163–71. https://doi.org/10.4071/isom-2017-WA12_066.
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