ISSN 2380-4505
Vol. 2017, Issue 1, 2017October 01, 2017 EDT
High Reliability and High Throughput Ball Bumping Process Solution – Solder Joint Encapsulant Adhesives
High Reliability and High Throughput Ball Bumping Process Solution – Solder Joint Encapsulant Adhesives
Liu, Mary, and Wusheng Yin. 2017. “High Reliability and High Throughput Ball Bumping Process Solution – Solder Joint Encapsulant Adhesives.” IMAPSource Proceedings 2017 (1): 1–7. https://doi.org/10.4071/isom-2017-TP11_031.