Investigation of Package Effects on the Edge Termination E-Field for HV WBG Power Semiconductors

Haotao Ke; Yifan Jiang; Adam J. Morgan; Douglas C. Hopkins

doi:10.4071/isom-2017-WA32_092

Loading [Contrib]/a11y/accessibility-menu.js

Ke, Haotao, Yifan Jiang, Adam J. Morgan, and Douglas C. Hopkins. 2017. “Investigation of Package Effects on the Edge Termination E-Field for HV WBG Power Semiconductors.” IMAPSource Proceedings 2017 (1): 224–30. https://doi.org/10.4071/isom-2017-WA32_092.

View more stats