Vol. 2017, Issue 1, 2017October 01, 2017 EDT
Investigation of Package Effects on the Edge Termination E-Field for HV WBG Power Semiconductors
Investigation of Package Effects on the Edge Termination E-Field for HV WBG Power Semiconductors
Ke, Haotao, Yifan Jiang, Adam J. Morgan, and Douglas C. Hopkins. 2017. “Investigation of Package Effects on the Edge Termination E-Field for HV WBG Power Semiconductors.” IMAPSource Proceedings 2017 (1): 224–30. https://doi.org/10.4071/isom-2017-WA32_092.