Vol. 2017, Issue 1, 2017October 01, 2017 EDT
Investigation of Wafer Level Packaging schemes for 3D RF interposer multi-chip module
Investigation of Wafer Level Packaging schemes for 3D RF interposer multi-chip module
Vereecke, Bart, Philippe Soussan, and Jian Zhu. 2017. “Investigation of Wafer Level Packaging Schemes for 3D RF Interposer Multi-Chip Module.” IMAPSource Proceedings 2017 (1): 258–62. https://doi.org/10.4071/isom-2017-WA41_030.