Vol. 2017, Issue 1, 2017October 01, 2017 EDT
Development of Stacking Process for 3D TSV (Through Silicon Via) Structure using Laser
Development of Stacking Process for 3D TSV (Through Silicon Via) Structure using Laser
Choi, Kwang-Seong, Wagno Alves Braganca, Keon-Soo Jang, Hyun-Cheol Bae, and Yong-Sung Eom. 2017. “Development of Stacking Process for 3D TSV (Through Silicon Via) Structure Using Laser.” IMAPSource Proceedings 2017 (1): 67–71. https://doi.org/10.4071/isom-2017-TP31_027.