Encapsulation of Microelectronic Assemblies for use in Harsh Environments

H. Varner; J. Mahaffey; T. Marinis; C. DiBiasio

doi:10.4071/isom-2017-WA51_072

Varner, H., J. Mahaffey, T. Marinis, and C. DiBiasio. 2017. “Encapsulation of Microelectronic Assemblies for Use in Harsh Environments.” IMAPSource Proceedings 2017 (1): 292–99. https://doi.org/10.4071/isom-2017-WA51_072.

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Encapsulation of Microelectronic Assemblies for use in Harsh Environments

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