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Symposium Proceedings
Vol. 2017, Issue 1, 2017October 01, 2017 EDT

High Density, Tall Cu Pillars for 3D Packaging

Tom Swarbrick, Kevin Martin, Kousuki Mori,
Advanced Packaging 2.5D 3D High Density Cu Pillar TSV Stepper Electro-Plating ECD Cu Plating Thick Resist
• https://doi.org/10.4071/isom-2017-WP15_017
IMAPSource Conference Papers
Swarbrick, Tom, Kevin Martin, and Kousuki Mori. 2017. “High Density, Tall Cu Pillars for 3D Packaging.” IMAPSource Proceedings 2017 (1): 346–52. https://doi.org/10.4071/isom-2017-WP15_017.
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