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Symposium Proceedings
Vol. 2017, Issue 1, 2017October 01, 2017 EDT

High Density, Tall Cu Pillars for 3D Packaging

Tom Swarbrick, Kevin Martin, Kousuki Mori,
Advanced Packaging2.5D3DHigh Density Cu PillarTSVStepperElectro-PlatingECDCu PlatingThick Resist
https://doi.org/10.4071/isom-2017-WP15_017
IMAPSource Conference Papers
Swarbrick, Tom, Kevin Martin, and Kousuki Mori. 2017. “High Density, Tall Cu Pillars for 3D Packaging.” IMAPSource Proceedings 2017 (1): 346–52. https:/​/​doi.org/​10.4071/​isom-2017-WP15_017.
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