High Density, Tall Cu Pillars for 3D Packaging

Tom Swarbrick; Kevin Martin; Kousuki Mori

doi:10.4071/isom-2017-WP15_017

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Swarbrick, Tom, Kevin Martin, and Kousuki Mori. 2017. “High Density, Tall Cu Pillars for 3D Packaging.” IMAPSource Proceedings 2017 (1): 346–52. https://doi.org/10.4071/isom-2017-WP15_017.

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