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Symposium Proceedings
Vol. 2017, Issue 1, 2017
October 01, 2017 EDT
High Density, Tall Cu Pillars for 3D Packaging
Tom Swarbrick
,
Kevin Martin
,
Kousuki Mori
,
Advanced Packaging
2.5D
3D
High Density Cu Pillar
TSV
Stepper
Electro-Plating
ECD
Cu Plating
Thick Resist
•
https://doi.org/10.4071/isom-2017-WP15_017
IMAPSource Conference Papers
Swarbrick, Tom, Kevin Martin, and Kousuki Mori. 2017. “High Density, Tall Cu Pillars for 3D Packaging.”
IMAPSource Proceedings
2017 (1): 346–52.
https://doi.org/10.4071/isom-2017-WP15_017
.
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