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Symposium Proceedings
Vol. 2017, Issue 1, 2017
October 01, 2017 EDT
Next Generation Xeon Server Package Architecture
Raja Swaminathan
,
Ram Viswanath
,
Sriram Srinivasan
,
Arun Chandrasekhar
,
PoINT
Patch
interposer
mid-level interconnect
packaging
low temperature solder
•
https://doi.org/10.4071/isom-2017-WP14_110
IMAPSource Conference Papers
Swaminathan, Raja, Ram Viswanath, Sriram Srinivasan, and Arun Chandrasekhar. 2017. “Next Generation Xeon Server Package Architecture.”
IMAPSource Proceedings
2017 (1): 342–45.
https://doi.org/10.4071/isom-2017-WP14_110
.
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