Fan-Out Wafer-Level Packaging (FOWLP) of Large Chip with Multiple Redistribution-Layers (RDLs)

John Lau; Ming Li; Nelson Fan; Eric Kuah; Zhang Li; Kim Hwee Tan; Tony Chen; Iris Xu; Margie Li; Y. M. Cheung; Wu Kai; Ji Hao; Rozalia Beica; Tom Taylor; CT Ko; Henry Yang; YH Chen; Sze Pei Lim; NC Lee; Jiang Ran; Koh Sau Wee; Qingxiang Yong; Cao Xi; Mian Tao; Jeffery Lo; Ricky Lee

doi:10.4071/isom-2017-THA35_056

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Lau, John, Ming Li, Nelson Fan, Eric Kuah, Zhang Li, Kim Hwee Tan, Tony Chen, et al. 2017. “Fan-Out Wafer-Level Packaging (FOWLP) of Large Chip with Multiple Redistribution-Layers (RDLs).” IMAPSource Proceedings 2017 (1): 576–83. https://doi.org/10.4071/isom-2017-THA35_056.

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