Skip to main content
null
IMAPSource Conference Papers
  • Menu
  • Articles
    • Ceramics Conference Papers
    • Device Packaging Conference Presentations
    • EMPC Conference Proceedings (IMAPS Europe)
    • General
    • High Temperature Conference Papers
    • IMAPS Chapter Conferences
    • Symposium Proceedings
    • All
  • For Authors
  • Editorial Board
  • About
  • Issues
  • Journal Micro & Elect Pkg
  • search

RSS Feed

Enter the URL below into your favorite RSS reader.

http://localhost:10836/feed
Symposium Proceedings
Vol. 2017, Issue 1, 2017October 01, 2017 EDT

Fan-Out Wafer-Level Packaging (FOWLP) of Large Chip with Multiple Redistribution-Layers (RDLs)

John Lau, Ming Li, Nelson Fan, Eric Kuah, Zhang Li, Kim Hwee Tan, Tony Chen, Iris Xu, Margie Li, Y. M. Cheung, Wu Kai, Ji Hao, Rozalia Beica, Tom Taylor, CT Ko, Henry Yang, YH Chen, Sze Pei Lim, NC Lee, Jiang Ran, Koh Sau Wee, Qingxiang Yong, Cao Xi, Mian Tao, Jeffery Lo, Ricky Lee,
FOWLPchip firstface-upreconstituted waferredistribution layer
https://doi.org/10.4071/isom-2017-THA35_056
IMAPSource Conference Papers
Lau, John, Ming Li, Nelson Fan, Eric Kuah, Zhang Li, Kim Hwee Tan, Tony Chen, et al. 2017. “Fan-Out Wafer-Level Packaging (FOWLP) of Large Chip with Multiple Redistribution-Layers (RDLs).” IMAPSource Proceedings 2017 (1): 576–83. https:/​/​doi.org/​10.4071/​isom-2017-THA35_056.
Save article as...▾

View more stats

This website uses cookies

We use cookies to enhance your experience and support COUNTER Metrics for transparent reporting of readership statistics. Cookie data is not sold to third parties or used for marketing purposes.

Powered by Scholastica, the modern academic journal management system