Vol. 2017, Issue 1, 2017October 01, 2017 EDT
Fan-Out Wafer-Level Packaging (FOWLP) of Large Chip with Multiple Redistribution-Layers (RDLs)
Fan-Out Wafer-Level Packaging (FOWLP) of Large Chip with Multiple Redistribution-Layers (RDLs)
Lau, John, Ming Li, Nelson Fan, Eric Kuah, Zhang Li, Kim Hwee Tan, Tony Chen, et al. 2017. “Fan-Out Wafer-Level Packaging (FOWLP) of Large Chip with Multiple Redistribution-Layers (RDLs).” IMAPSource Proceedings 2017 (1): 576–83. https://doi.org/10.4071/isom-2017-THA35_056.