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Symposium Proceedings
Vol. 2017, Issue 1, 2017
October 01, 2017 EDT
Highly Reliable Cu Wiring Layer of 1/1 μm Line/Space Using Newly Designed Insulation Barrier Film
Kazuyuki Mitsukura
,
Shinichiro Abe
,
Masaya Toba
,
Tomonori Minegishi
,
Kazuhiko Kurafuchi
,
Interposer
Fan-out Package
Trench wiring
Photosensitive dielectric
Biased HAST
Insulation reliability
Insulation barrier film(iBF)
•
https://doi.org/10.4071/isom-2017-TP53_003
IMAPSource Conference Papers
Mitsukura, Kazuyuki, Shinichiro Abe, Masaya Toba, Tomonori Minegishi, and Kazuhiko Kurafuchi. 2017. “Highly Reliable Cu Wiring Layer of 1/1 Μm Line/Space Using Newly Designed Insulation Barrier Film.”
IMAPSource Proceedings
2017 (1): 140–45.
https://doi.org/10.4071/isom-2017-TP53_003
.
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