Highly Reliable Cu Wiring Layer of 1/1 μm Line/Space Using Newly Designed Insulation Barrier Film

Kazuyuki Mitsukura; Shinichiro Abe; Masaya Toba; Tomonori Minegishi; Kazuhiko Kurafuchi

doi:10.4071/isom-2017-TP53_003

Mitsukura, Kazuyuki, Shinichiro Abe, Masaya Toba, Tomonori Minegishi, and Kazuhiko Kurafuchi. 2017. “Highly Reliable Cu Wiring Layer of 1/1 Μm Line/Space Using Newly Designed Insulation Barrier Film.” IMAPSource Proceedings 2017 (1): 140–45. https://doi.org/10.4071/isom-2017-TP53_003.

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Highly Reliable Cu Wiring Layer of 1/1 μm Line/Space Using Newly Designed Insulation Barrier Film

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