Multi-dimensional Ultrasonic Copper Bonding – New Challenges for Tool Design

Paul Eichwald; Simon Althoff; Reinhard Schemmel; Walter Sextro; Andreas Unger; Michael Brökelmann; Matthias Hunstig

doi:10.4071/isom-2017-WP43_071

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Eichwald, Paul, Simon Althoff, Reinhard Schemmel, Walter Sextro, Andreas Unger, Michael Brökelmann, and Matthias Hunstig. 2017. “Multi-Dimensional Ultrasonic Copper Bonding – New Challenges for Tool Design.” IMAPSource Proceedings 2017 (1): 438–43. https://doi.org/10.4071/isom-2017-WP43_071.

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