ISSN 2380-4505
Vol. 2026 Silicon Valley Chapter, Issue August, 2026September 21, 2026 EDT
Advancing AI with Advanced Packaging
Advancing AI with Advanced Packaging
Articles in Vol. 2026 Silicon Valley Chapter, Issue August, 2026
Vol. 2026 Silicon Valley Chapter, Issue August, 2026
- AI Inference at the Data-Movement Ceiling: A Workload View of Advanced PackagingDong Hyuk Woo
- Advancing AI with Advanced PackagingHenley LiuHemanth Dhavaleswarapu
- The Critical Role of Hybrid Bonding in driving Architectures for AI and High Performance ComputingVineeth Reddy BijjamThomas Pleschke
- Liquid Compression Mold Underfill (LCMUF): Optimizing the Flow-Warpage Trade-off for High-Density Fan-Out Advanced PackagingJack Melton
- AI-Driven Process Control for Advanced PackagingChet Lenox
- Power Delivery in Advanced IC PackagingMike Kelly
- System-Level Thermal Validation of 2.5D Packages in GPU Servers: TCB vs. HCB HBM PlatformsEduardo PachecoLinus ParkYouchang NaSeongjin HongYoko TomoHae Jung YuYanggyoo JungGyungbum KimHeeyoub Kang KangYeonghyeon GimJaechoon KimYun Seok Choi
- Continuous Physics Reasoning: Physics as Always-On Design InfrastructureRahima Mohammed
- Physical AI for Autonomous Manufacturing: Real Time Sensing, Data, Models, Control, and Advanced PackagingEun Ho Lee
Liu, Henley, and Hemanth Dhavaleswarapu. 2026. “Advancing AI with Advanced Packaging.” IMAPSource Proceedings 2026 Silicon Valley Chapter (August): 28–44. https://doi.org/10.4071/001c.171409.