ISSN 2380-4505
Vol. 2025, Issue Symposium, 2025November 10, 2025 EDT
Thermal Performance of High Thermal Conductivity TIM for Large Advanced Package through TTV Measurement and FEM Analysis Approach
Thermal Performance of High Thermal Conductivity TIM for Large Advanced Package through TTV Measurement and FEM Analysis Approach
Lin, Shane, Vito Lin, Andrew Kang, and Y.P. Wang. 2025. “Thermal Performance of High Thermal Conductivity TIM for Large Advanced Package through TTV Measurement and FEM Analysis Approach.” IMAPSource Proceedings 2025 (Symposium): 360–64. https://doi.org/10.4071/001c.147482.