ISSN 2380-4505
Vol. 2025, Issue Symposium, 2025November 10, 2025 EDT
PFAS Free, High Reliability and Multisurface Die Attach for QFN Packages
PFAS Free, High Reliability and Multisurface Die Attach for QFN Packages
Dhoble, Avin, Senthil Kanagavel, Elisia Siow, and Tim Kuo. 2025. “PFAS Free, High Reliability and Multisurface Die Attach for QFN Packages.” IMAPSource Proceedings 2025 (Symposium): 311–14. https://doi.org/10.4071/001c.147285.