ISSN 2380-4505
Vol. 2025, Issue Symposium, 2025November 10, 2025 EDT
Impact of Solder Powder Size on Cleaning Efficiency in Chip Resistor Assemblies for Future Advanced Packaging
Impact of Solder Powder Size on Cleaning Efficiency in Chip Resistor Assemblies for Future Advanced Packaging
Kumar, B. Senthil, Zhang Rui Fen, Zhang HanWen, SS Kang, and Ravi Parthasarathy. 2025. “Impact of Solder Powder Size on Cleaning Efficiency in Chip Resistor Assemblies for Future Advanced Packaging.” IMAPSource Proceedings 2025 (Symposium): 280–89. https://doi.org/10.4071/001c.147225.