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ISSN 2380-4505
Symposium Proceedings
Vol. 2025, Issue Symposium, 2025November 10, 2025 EDT

Fine-Pitch RDL with High Reliability Formed on Glass for Heterogeneous Integration

Takamasa Takano, Satoru Kuramochi, Hidetoshi Iioka, Takao Shindou,
High-speed data transmissionHigh reliabilityFine line RDLLarge chip sizeInorganic dielectric-coated wiringElectromigration
https://doi.org/10.4071/001c.147214
IMAPSource Conference Papers
Takano, Takamasa, Satoru Kuramochi, Hidetoshi Iioka, and Takao Shindou. 2025. “Fine-Pitch RDL with High Reliability Formed on Glass for Heterogeneous Integration.” IMAPSource Proceedings 2025 (Symposium): 249–54. https:/​/​doi.org/​10.4071/​001c.147214.

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