ISSN 2380-4505
Vol. 2025, Issue Symposium, 2025November 10, 2025 EDT
Fabrication and Packaging of Edge Coupled Silicon Nitride Photonic Integrated Circuits on Glass Substrates for High Performance Interposers
Fabrication and Packaging of Edge Coupled Silicon Nitride Photonic Integrated Circuits on Glass Substrates for High Performance Interposers
Weninger, Drew, Samuel Serna, Luigi Ranno, Lionel Kimerling, and Anuradha Agarwal. 2025. “Fabrication and Packaging of Edge Coupled Silicon Nitride Photonic Integrated Circuits on Glass Substrates for High Performance Interposers.” IMAPSource Proceedings 2025 (Symposium): 242–48. https://doi.org/10.4071/001c.147207.