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ISSN 2380-4505
Symposium Proceedings
Vol. 2025, Issue Symposium, 2025November 10, 2025 EDT

Enhancd Copper Adhesion on Glass Via Adhesion Promotion Coating

Shuyang Kao, Ying-Hsuan Yeh, Simon McElrea, Roger Terrill, Sunity Sharma,
Atomic PalladiumElectroless CopperGlass Core IC-SubstratesTGV (Through Glass Vias)LMIx® (Liquid Metal InkTM)
https://doi.org/10.4071/001c.147206
IMAPSource Conference Papers
Kao, Shuyang, Ying-Hsuan Yeh, Simon McElrea, Roger Terrill, and Sunity Sharma. 2025. “Enhancd Copper Adhesion on Glass Via Adhesion Promotion Coating.” IMAPSource Proceedings 2025 (Symposium): 235–41. https:/​/​doi.org/​10.4071/​001c.147206.

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