ISSN 2380-4505
Vol. 2025, Issue Symposium, 2025November 10, 2025 EDT
Pulse Reverse Electroplating for Copper Filling in High Aspect Ratio Through Glass Vias for Advanced Packaging
Pulse Reverse Electroplating for Copper Filling in High Aspect Ratio Through Glass Vias for Advanced Packaging
Fiedler, Dennis, Grigory Vazhenin, Holger Schulz, Henning Hübner, Tobias Sponholz, Mustafa Oezkoek, and HeeBum Shin. 2025. “Pulse Reverse Electroplating for Copper Filling in High Aspect Ratio Through Glass Vias for Advanced Packaging.” IMAPSource Proceedings 2025 (Symposium): 230–34. https://doi.org/10.4071/001c.147205.