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ISSN 2380-4505
Symposium Proceedings
Vol. 2025, Issue Symposium, 2025November 10, 2025 EDT

Study of High Adhesion Plating Process Using Metal Oxide on Glass for Advanced Packaging

Kazuhiro Hirooka, Honoka Nakagawa, Mayu Tsukuda, Jun-ichi Katayama, Toshimitsu Nagao,
Advanced packagingGlass core substrateZinc oxideChiplet integrationTGVThough-hole filling
https://doi.org/10.4071/001c.147204
IMAPSource Conference Papers
Hirooka, Kazuhiro, Honoka Nakagawa, Mayu Tsukuda, Jun-ichi Katayama, and Toshimitsu Nagao. 2025. “Study of High Adhesion Plating Process Using Metal Oxide on Glass for Advanced Packaging.” IMAPSource Proceedings 2025 (Symposium): 225–29. https:/​/​doi.org/​10.4071/​001c.147204.

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