ISSN 2380-4505
Vol. 2025, Issue Symposium, 2025November 10, 2025 EDT
High-Performance PCB Materials for Next-Generation Electronics Packages, driving Signal Integrity, Power Handling, and Reliability
High-Performance PCB Materials for Next-Generation Electronics Packages, driving Signal Integrity, Power Handling, and Reliability
Coonrod, John, Lance Blaskowski, Vitali Judin, Karl Sprentall, and Mike Kuszaj. 2025. “High-Performance PCB Materials for Next-Generation Electronics Packages, Driving Signal Integrity, Power Handling, and Reliability.” IMAPSource Proceedings 2025 (Symposium): 218–24. https://doi.org/10.4071/001c.147202.