Facilitating High-Reliability Cu-to-Cu Direct Bonding via Tunable Cu-selective Oxide suppression Coating for Advanced Interconnects

Kevin Antony Jesu Durai; Dinesh Kumar Kumaravel; Khanh Tuyet Anh Tran; Duwage Anushka Sandaruwan Perera; Hsing-Chien Chien; Po-Wen Chiu; Kuei-Hsien Chen; Oliver Chyan

doi:10.4071/001c.147199

Durai, Kevin Antony Jesu, Dinesh Kumar Kumaravel, Khanh Tuyet Anh Tran, Duwage Anushka Sandaruwan Perera, Hsing-Chien Chien, Po-Wen Chiu, Kuei-Hsien Chen, and Oliver Chyan. 2025. “Facilitating High-Reliability Cu-to-Cu Direct Bonding via Tunable Cu-Selective Oxide Suppression Coating for Advanced Interconnects.” IMAPSource Proceedings 2025 (Symposium): 202–8. https://doi.org/10.4071/001c.147199.

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