ISSN 2380-4505
Vol. 2025, Issue Symposium, 2025November 10, 2025 EDT
Investigation of Cu-Cu Stitch Bonding Reliability on Cu Leadframe Substrate Using Ultrathin Cu-Selective Passivation
Investigation of Cu-Cu Stitch Bonding Reliability on Cu Leadframe Substrate Using Ultrathin Cu-Selective Passivation
Shyam Muralidharan Nair, Gavin Farmer, James Abraham, Duwage Anushka Sandaruwan Perera, Usha Philipose, Oliver Chyan,
Nair, Shyam Muralidharan, Gavin Farmer, James Abraham, Duwage Anushka Sandaruwan Perera, Usha Philipose, and Oliver Chyan. 2025. “Investigation of Cu-Cu Stitch Bonding Reliability on Cu Leadframe Substrate Using Ultrathin Cu-Selective Passivation.” IMAPSource Proceedings 2025 (Symposium): 194–201. https://doi.org/10.4071/001c.147198.