ISSN 2380-4505
Vol. 2025, Issue Symposium, 2025November 10, 2025 EDT
Impact of Burnished and Brushed Surface Preparation on Gold Bond Pads: Bond Strength and Wire Bond Quality in Microelectronics
Impact of Burnished and Brushed Surface Preparation on Gold Bond Pads: Bond Strength and Wire Bond Quality in Microelectronics
Forgione, Matteo. 2025. “Impact of Burnished and Brushed Surface Preparation on Gold Bond Pads: Bond Strength and Wire Bond Quality in Microelectronics.” IMAPSource Proceedings 2025 (Symposium): 186–93. https://doi.org/10.4071/001c.147197.