ISSN 2380-4505
Vol. 2025, Issue Symposium, 2025November 10, 2025 EDT
RF-SiP Chip Package Interaction Finite Element Analysis
RF-SiP Chip Package Interaction Finite Element Analysis
Zhang, Jiaping, and Yonghao An. 2025. “RF-SiP Chip Package Interaction Finite Element Analysis.” IMAPSource Proceedings 2025 (Symposium): 163–69. https://doi.org/10.4071/001c.147193.