ISSN 2380-4505
Vol. 2025, Issue Symposium, 2025November 10, 2025 EDT
Validating Reduced Order Model for Solder Reliability of Leadless Ceramic Chip Component during Temperature Cycling
Validating Reduced Order Model for Solder Reliability of Leadless Ceramic Chip Component during Temperature Cycling
Purushotaman, Arvind, Natalie Raines, and Nathan Blattau. 2025. “Validating Reduced Order Model for Solder Reliability of Leadless Ceramic Chip Component during Temperature Cycling.” IMAPSource Proceedings 2025 (Symposium): 157–62. https://doi.org/10.4071/001c.147192.