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ISSN 2380-4505
Symposium Proceedings
Vol. 2025, Issue Symposium, 2025November 10, 2025 EDT

Evaluation of Au-Si Eutectic Die-Attach for Power Hermetic Packages in Space Applications

Li Jiang, Ramlah Razak, Blake Travis, Guangxu Li, Kejun Zeng, Rongwei Zhang, Muhammad Khan, Rajen Murugan,
Die-AttachEutectic BondingHermetic PackageFEA
https://doi.org/10.4071/001c.147184
IMAPSource Conference Papers
Jiang, Li, Ramlah Razak, Blake Travis, Guangxu Li, Kejun Zeng, Rongwei Zhang, Muhammad Khan, and Rajen Murugan. 2025. “Evaluation of Au-Si Eutectic Die-Attach for Power Hermetic Packages in Space Applications.” IMAPSource Proceedings 2025 (Symposium): 115–20. https:/​/​doi.org/​10.4071/​001c.147184.

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