ISSN 2380-4505
Vol. Sept 2025 Fl Chapter H-SiP, 2025November 11, 2025 EDT
NANODIAMOND THICK FILMS FOR THERMAL MANAGEMENT
NANODIAMOND THICK FILMS FOR THERMAL MANAGEMENT
Articles in Vol. Sept 2025 Fl Chapter H-SiP, 2025
Vol. Sept 2025 Fl Chapter H-SiP, 2025
- Making Florida a Microelectronics Hub: Updates on Federal & State Microelectronics Initiatives (CHIPS Act and Florida Semiconductor-Related Programs)Michael Aller
- QUANTUM-DRIVEN SEMICONDUCTOR PACKAGING FOR HPCMancy Huang
- Heterogeneous Integration in Florida Enabling High Bandwidth SubsystemsGlenn Oliver
- Supply Chain Shortcuts Can COTS be Mission Critical?Reed Coffey
- AI-Driven Non-Destructive Characterization for Advanced Packaging: Challenges, Frameworks, and OpportunitiesPatrick CraigNavid Asadi
- Multiphysics Nanoparticle Assembly: Design, Simulation, and ApplicationsSteve Snyder
- System Modeling for Advanced AI Superconducting HardwareHasantha MalavipathiranaManu Perumkunnil
- NANODIAMOND THICK FILMS FOR THERMAL MANAGEMENTMatthew Bauer
- Silicon Pathways: A Hands-On Learning Experience in Semiconductor OperationsEileen Smith
- NeoCity AcademyJeremiah SwartzJaylon ProphetJosera BarranWei YangSara VelezSamantha ValenzuelaQianyu HuangVictoria WongWael Cherkaoui ElmalkiJ’den DorismondAlejandro Bracho
Bauer, Matthew. 2025. “NANODIAMOND THICK FILMS FOR THERMAL MANAGEMENT.” IMAPSource Proceedings Sept 2025 Fl Chapter H-SiP (November). https://doi.org/10.4071/001c.147142.