ISSN 2380-4505
Vol. 2025, Issue Symposium, 2025November 10, 2025 EDT
Core Crack Mitigation in Semiconductor Substrates: A Multi-Scale Simulation Approach to Design Organic Core Material Properties
Core Crack Mitigation in Semiconductor Substrates: A Multi-Scale Simulation Approach to Design Organic Core Material Properties
Kindaichi, Rimpei, Masaki Takahashi, Atsuko Ueda, Takashi Masuko, Kosuke Urashima, and Keita Johno. 2025. “Core Crack Mitigation in Semiconductor Substrates: A Multi-Scale Simulation Approach to Design Organic Core Material Properties.” IMAPSource Proceedings 2025 (Symposium): 109–14. https://doi.org/10.4071/001c.147120.