ISSN 2380-4505
Vol. 2025, Issue Symposium, 2025November 10, 2025 EDT
Advanced Modeling of Cure Shrinkage and Viscoelasticity for Warpage Prediction on Image Sensor Packaging
Advanced Modeling of Cure Shrinkage and Viscoelasticity for Warpage Prediction on Image Sensor Packaging
Liu, Ning, Shahram Seyedmohammadi, Howard Yun, and Matthew Tsai. 2025. “Advanced Modeling of Cure Shrinkage and Viscoelasticity for Warpage Prediction on Image Sensor Packaging.” IMAPSource Proceedings 2025 (Symposium): 101–8. https://doi.org/10.4071/001c.147119.