Warpage Analysis of Lidded Flip Chip CSP: Impact of Material Properties and Dimensions

Jun Chen; Mubsar Dhuka; Sharan Kishore; Nishant Lakhera; Jetse de Witte; Betty Yeung

doi:10.4071/001c.147117

Chen, Jun, Mubsar Dhuka, Sharan Kishore, Nishant Lakhera, Jetse de Witte, and Betty Yeung. 2025. “Warpage Analysis of Lidded Flip Chip CSP: Impact of Material Properties and Dimensions.” IMAPSource Proceedings 2025 (Symposium): 281–87. https://doi.org/10.4071/001c.147117.

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