ISSN 2380-4505
Vol. 2025, Issue Symposium, 2025November 10, 2025 EDT
Module Stress Reduction for 2.5D TSV-based Heterogeneous Package
Module Stress Reduction for 2.5D TSV-based Heterogeneous Package
Jung, Hoon, Quan Pham, Bryce Lukehart, Haamid Juvale, MinKeon Lee, JunOh Bong, and HyungSang Park. 2025. “Module Stress Reduction for 2.5D TSV-Based Heterogeneous Package.” IMAPSource Proceedings 2025 (Symposium): 96–100. https://doi.org/10.4071/001c.147115.