ISSN 2380-4505
Vol. 2025, Issue Symposium, 2025November 10, 2025 EDT
Cleaning Challenge of Die Attach Process in FCBGA with Larger Die Sizes and Finer Bump Pitches
Cleaning Challenge of Die Attach Process in FCBGA with Larger Die Sizes and Finer Bump Pitches
Chang, Chia-Wei, Wen-Yu Teng, Liang-Yih Hung, Yu-Cheng Pai, Andrew Kang, and Yu-Po Wang. 2025. “Cleaning Challenge of Die Attach Process in FCBGA with Larger Die Sizes and Finer Bump Pitches.” IMAPSource Proceedings 2025 (Symposium): 66–70. https://doi.org/10.4071/001c.147104.