Electromigration Challenges in FCQFN Packaging: Impact of Solder Thickness and Shape on Reliability

Min-Yan Tsai; Shan-Bo Wang; Yung-Sheng Lin; Christophe Zinck; Antonio Zuccaro; G. Livio Gobbato; Chen-Chao Wang; Chih-Pin Hung

doi:10.4071/001c.147103

Tsai, Min-Yan, Shan-Bo Wang, Yung-Sheng Lin, Christophe Zinck, Antonio Zuccaro, G. Livio Gobbato, Chen-Chao Wang, and Chih-Pin Hung. 2025. “Electromigration Challenges in FCQFN Packaging: Impact of Solder Thickness and Shape on Reliability.” IMAPSource Proceedings 2025 (Symposium): 60–65. https://doi.org/10.4071/001c.147103.

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