ISSN 2380-4505
Vol. 2025, Issue Symposium, 2025November 10, 2025 EDT
Simplification of Via-first TSV and Backside Interconnect Process for Large-Scale Superconducting Quantum Annealing Circuits
Simplification of Via-first TSV and Backside Interconnect Process for Large-Scale Superconducting Quantum Annealing Circuits
Watanabe, Naoya, Yuuki Araga, Ayuka Morioka, Kunihiko Ishihara, Tomohiro Nishiyama, and Katsuya Kikuchi. 2025. “Simplification of Via-First TSV and Backside Interconnect Process for Large-Scale Superconducting Quantum Annealing Circuits.” IMAPSource Proceedings 2025 (Symposium): 44–48. https://doi.org/10.4071/001c.147098.