ISSN 2380-4505
Vol. 2025, Issue Symposium, 2025November 10, 2025 EDT
Sub-Micron Patterning & High-Aspect-Ratio Structures in Advanced Substrates with Dry Etching and Liquid Metal Ink Metallization
Sub-Micron Patterning & High-Aspect-Ratio Structures in Advanced Substrates with Dry Etching and Liquid Metal Ink Metallization
Liu, Siyang, Shuyang Kao, Rey Co, Simon McElrea, Sunity Sharma, Roger H. Terrill, and Hongbin Yu. 2025. “Sub-Micron Patterning & High-Aspect-Ratio Structures in Advanced Substrates with Dry Etching and Liquid Metal Ink Metallization.” IMAPSource Proceedings 2025 (Symposium): 33–38. https://doi.org/10.4071/001c.147097.