ISSN 2380-4505
Vol. 2025, Issue Symposium, 2025November 10, 2025 EDT
Novel Optical Bumps using Graded Index Couplers for Flip-Chip Photonic Packaging
Novel Optical Bumps using Graded Index Couplers for Flip-Chip Photonic Packaging
Weninger, Drew, Christian Duessel, Samuel Serna, Lionel Kimerling, and Anuradha Agarwal. 2025. “Novel Optical Bumps Using Graded Index Couplers for Flip-Chip Photonic Packaging.” IMAPSource Proceedings 2025 (Symposium): 13–22. https://doi.org/10.4071/001c.147093.