Pitch Interconnection and Packaging Studies for Hybrid Electronics with Aerosol Jet Printed Particle-Free Ag Ink

Abdullah S. Obeidat; Dylan Richmond; Jordan Howard-Jennings; Ashraf Umar; Riadh Al-Haidari; Mohammed Alhendi; Behnam Garakani; Detlef-M. Smilgies; Mark D. Poliks

doi:10.4071/001c.129768

Obeidat, Abdullah S., Dylan Richmond, Jordan Howard-Jennings, Ashraf Umar, Riadh Al-Haidari, Mohammed Alhendi, Behnam Garakani, Detlef-M. Smilgies, and Mark D. Poliks. 2025. “Pitch Interconnection and Packaging Studies for Hybrid Electronics with Aerosol Jet Printed Particle-Free Ag Ink.” IMAPSource Proceedings 2024 (Symposium): 203–8. https://doi.org/10.4071/001c.129768.

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