ISSN 2380-4505
Vol. 2024, Issue Symposium, 2024February 13, 2025 EDT
Control of Cu Microstructure and Properties for Low-Temperature Direct Cu-Cu Bonding
Control of Cu Microstructure and Properties for Low-Temperature Direct Cu-Cu Bonding
Gannett, Cara, Youngmin Yoon, Gabrielle Page, Derek Thoresen, Brian Parquette, Matthew Gole, Matthew Van Hanehem, and Ravi Pokhrel. 2025. “Control of Cu Microstructure and Properties for Low-Temperature Direct Cu-Cu Bonding.” IMAPSource Proceedings 2024 (Symposium): 113–18. https://doi.org/10.4071/001c.129766.
